Just days after Broadcom demoed a chip with integrated Wi-Fi, Bluetooth and FM reception, competitor Texas Instruments answered back with a better integrated chip that adds Bluetooth 2.1 and 802.11n.

Like its Broadcom counterpart, the TI chip is built using 65-nanometer processes. It would also be the first mobile-based 802.11n solution. For voice over WLAN functionality, call quality and reliability would increase, the company says.

"TI is enabling true voice over IP and personal audio broadcasting - allowing people to use their phone in ways they never have before," TI mobile solutions chief Marc Cetto said.

Called WiLink 6.0, the chip is being billed as a complete "antenna to application" solution for mid and low-tier handsets. It is also built to work seamlessly with the company's OMAP-Vox line of mobile processors.

According to research firm Forward Concepts, TI leads all other chipmakers in mobile WLAN application shipments. Analysts say that chips like WiLink will help to push Wi-Fi and Bluetooth further into the mobile mass market.

In addition to the WiLink 6.0 chip, TI also introduced the BlueLink 7.0 chip, which integrates FM functionality with Bluetooth 2.1 support. Added in this version is FM transmission, which would allow for the playing of music files on any FM-capable receiver.

But it will still be at least a year before these chips make it into the hands of consumers. The first phones based on the technologies are not expected to be available until 2008 at the earliest.